Industrial Consortium

HIsarna Process Stability

The HIsarna ironmaking process is a direct reduced iron process for iron making in which iron ore is processed almost directly into liquid iron. This makes the HIsarna process more energy-efficient with a lower carbon footprint: more than 50% CO2 emission reduction is possible compared to traditional processes as demonstrated by Tata Steel in 2018. Now this technology is being prepared for commercialization it is necessary to fine tune the process stability.

Optimised customer shaving design

Philips has been producing electric shavers for more than 50 years, which means that the shaver is a very mature product with a high quality. In this case, full digitization of the product development cycle can offer a disruptive innovation which allows for the customization of the product for different type of individuals and the production of the shaver as lean as possible.

Health monitoring and preventive maintenance for high-end printers

Professional printers are expected to be highly productive and customers expect them to work reliably 24×7. In a rapidly evolving printing world conventional design engineering approaches are simply too slow. Integration of system health monitoring will enable Canon Production Printing to provide effective predictive maintenance to their printing systems. This will help in increased functional up-time of printer, reduced service cost and improved customer satisfaction.

Use case: Wafer Handler Robots

The wafer handler is a vital sub-systems in a photo-lithography machine. It performs the following high-level functions: (i) thermally condition the wafer, (ii) measure and improve the positioning accuracy of the wafer, and (iii) perform transport of wafers between the track and the wafer stage at a specified throughput rate. In a specific type of wafer handler, there are two SCARA robots – the load and unload robots – that perform the transport functions mentioned above. Each SCARA robot is a 3 degree-of-freedom (R, phi and Z) robot equipped with a gripper that can hold a wafer via vacuum pads.

VDL-ETG executes total lifecycle management for the so-called Wafer Handler (WH) system. The WH is a subsystem of the ASML lithography machine, providing for in- and output of the semiconductor substrates (wafers). The WH module is subject to incidents, causing unavailability of the lithography machine. A key component in the WH module is a WH robot, a high-end mechatronic module, taking care of wafer picking, moving and placing, at high speeds whilst maintaining accuracy and cleanliness.

Within Project 4 we aim to improve availability of the wafer handler by employing preventive maintenance. In preventive maintenance, imminent failures are predicted, so maintenance actions can be scheduled to prevent the failure from happening, turning (much more expensive) unscheduled down-time into scheduled down-time. The health monitoring and preventive maintenance technology developed in Project 4 will be implemented on and applied to the WH module of VDL-ETG.

Use case: Adaptive process control of robot based production cell for composites manufacturing

Airborne is technology leader in advanced composites, specializing in the automation and digitalization of the manufacturing of composite parts for aerospace, space and other industries. A number of standardized automated manufacturing cells are available that offer solutions for automating the most common processes in composites manufacturing. An example is the above depicted Automated laminating cell (ALC) which places pre-impregnated tape to create a product.

The objective is to make a 6-axis robot-based Automated Laminating Cell accurate enough to comply with high quality requirements such as for space applications, which so far no one has achieved with a robot based platform. The results of the DIGITAL TWIN project will lead to a much more advanced adaptive process control to bring the standard low cost equipment (standard robot based automated tape lay (ATL)) to a higher level of lay-up accuracy.

Airborne expects that the cost for such a high accuracy machine can be constrained by keeping the platform the same, but finding the resolution in smart sensing, advanced computer algorithms and autonomous adaptive control using digital twinning techniques. In such a way, the autonomous machine should not only correct for its own deviations or imperfect behavior, but also for effects from outside, and material and substrate variations.

 

Use case: Digital Twin of industrial wire bonder machine

Strengthening the competitive edge in the market of the assembly and packaging equipment for electronics manufacturing, digitalization and virtualization is of increasingly importance at ASM Pacific Technology LTD. Especially digital twins of the ASM products are getting particular attention, because of their values in all phases of equipment development, production and operational use.

Strengthening the competitive edge in the market of the assembly and packaging equipment for electronics manufacturing, digitalization and virtualization is of increasingly importance at ASM Pacific Technology LTD. Especially digital twins of the ASM products are getting particular attention, because of their values in all phases of equipment development, production and operational use.